The FC300 High Force Die / Flip Chip Bonder is a new generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafer up to 300 mm. It features also Nanoimprinting Lithography (NIL) capabilities.
With a quick process head reconfiguration, the FC300 platform performs multiple applications including:
– High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging, or Nanoimprinting using a Hot Embossing Lithography process.
– Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly.
– UV-Curing for a Adhesive Bonding or for Nanoimprinting using a UV-NIL process.