Unique high-speed laser cutting system for the highest operational and economic efficiency.
The shortest part times thanks to the efficient combination of highspeed plasma cutting with high machine dynamics.
15 – 40 % shorter cutting times with the help of the 3.75-inch cutting head optimized for thin-sheet applications.
Minimal operating costs due to power-saving and abrasion-free semiconductor power supply and magnet-mounted compressors.
Great process stability thanks to the latest Bystronic technologies.