Wow! Have you seen Avatar in 3D? 
This movie adds a whole new meaning to 3D. And sometimes we forget that the rest of the world is 3D including the product that electronics industry companies design. So why do we sometimes limit our design capabilities to only consider the 2D aspects of the PCB? Certainly the mechanical design MCAD world has gone mostly 3D.
In a viewpoint I wrote for PCD&F magazine I talked about the need and existing/emerging capabilites that link MCAD to the electronics (ECAD) and enable the two very different disciplines to collaborate real time during the product design process. The example I highlighted was the need for thermal analysis not only at the standalone PCB level but also with the PCB(s) in the full 3D enclosure using Mentor’s FloTHERM/FloEFD capabilities. But this is only one example.
Even the PCB and packages are going 3D now with cavities, direct chip attach using wirebonds, die stacking, and Ridgid-flex designs that need to be folded to fit into the product enclosure. So the need to consider a product design and manufacturing as a 3D challenge is increasing. Aspects like HALT (Highly Accelerated Lifetime Testing) where software simulates the 3D vibration and temperaure cycling failure effects on the PCB’s reliability. PCB to enclosure interference checking. PCB pick and place assembly analysis and sequencing.
We’re committed and in the unique position as a PCB systems design supplier to continue expanding our 3D capabilities. You’ll see our R&D and some acquisitions with increasing emphasis on 3D. And by the way, if you haven’t seen Avatar in 3D, it’s worth the time.