HTC is keeping up the positive momentum in relation to the development of its flagship devices and there’s a new rumor surfacing out there that may continue to keep its competitors on its heels. Reports are coming in that HTC is considering the building of a smartphone with a Liquidmetal casing— which is an alloy nearly resistant to wear and tear. Moreover, HTC would look to keep the possibly use of the material locally by emploring Taiwanese firm Jabon International to provide the Liquidmetal chassis. As of now, Apple is the only manufacturer that has its sights on utilizing this technology in future devices, but the devices wouldn’t appear for a while— meaning HTC could more than certainly have a head start on Apple by introducing Liquidmetal-based devices as early as the second half of 2013.
source: Digitimes
Come comment on this article: HTC may be working on a new smartphone with Liquidmetal casing for the second half of 2013